Tsolver

PC software that complements THERMOscan for through-thickness temperature determination — helping users develop a further understanding of their process!

Principle

Temperature distribution between the internal and external surfaces is not always linear. Conversion of infrared radiation to heat through the preform wall is a complex phenomenon influenced by material, geometry and process conditions.

Data output

Using consecutive THERMOscan measurements, through-thickness temperature data is attainable for users that require a deeper understanding of their preform temperature distribution.

Simulation inputs

Data for simulation

Assess new geometries

Quality control

Efficient troubleshooting

Optimise set-up

© Blow Moulding Technologies 2020

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